Our customers use Astro Plasma microwave plasma cleaning machine and microwave plasma asher to meet the wide range of applications in semiconductor product manufacturing and other related fields.

The field of semiconductors involves sensors, LEDs, laser devices, optoelectronic devices, microwave and radio frequency communications, power supply, flash IC and other chip manufacturing, as well as the process application of the front and back channels including wafer level packaging.

Other related fields are related to the surface treatment technology application of materials such as automobiles, new energy batteries, solar panels, microfluidic chips, biomaterials, etc.

Microwave plasma cleaning and descumming process is an advanced dry process, using common industrial gases as raw materials, such as oxygen, nitrogen, argon, carbon tetrafluoride and other gases. Its environmentally friendly and efficient cleaning and degumming process has been recognized and promoted by more and more industry users.

The main applications of Astro Plasma include but are not limited to the following:

Plasma descumming (ashing): mainly refers to the removal of photoresist, which is generally applied after ion implantation or etching. The equipment can completely remove the normal positive and negative photoresist, such as AZ series, PI, SU-8, etc.

Descum: remove photoresist or polyimide PI, SU-8 and so on.

MEMS sacrificial layer release: for example, the sacrificial layer material under large area structure, such as PI or SU-8, can be removed by releasing through a small release hole. For this application, Astro Plasma has the unique advantages of microwave plasma system.

Plasma cleaning: dry removal of oxide or organic contamination residues on the surface of materials can greatly improve the quality of bonding WB and plastic molding in packaging process.

Surface activation or modification: for example, plasma surface activation treatment before wet etching can improve the wet etching effect and greatly improve the quality of bonding WB and plastic molding in packaging process.